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FCT Solder to Premier NC162 SN100C No-Clean Flux at APEX 2008

Mar 12, 2008

GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

NC162 is a third-generation liquid flux developed in response to the need for a high-activity halide-free no-clean alloy with superb solderability and minimal post-process residues, especially in palletized processes. NC162 works especially well with FCT Assembly�s SN100C Sn/Cu/Ni+Ge lead-free alloy, and is an excellent choice for soldering through-hole and mixed-technology assemblies.

NC162 has been formulated to provide the following benefits: halide-free, fully lead-free compatible, low post-process residues and excellent activity to promote hole fill. Additionally, the flux becomes more robust in high-temperature applications, and can be sprayed, foamed, or dipped.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C� lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com

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