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Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys

Mar 10, 2008

Breda, Holland -- Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior�s patented SN100C-alloy.

SN100C has demonstrated superior long-term fatigue strength over silver-containing SAC-alloys. Being completely free of silver, SN100C shines as the only true remedy against Cu-migration into the Sn regions of the solder joint. With XF3, wetting on all common metal surfaces is excellent, yielding shiny joints reminiscent of leaded solders. It exhibits a robust printing window, printing at 150-200mm per second. SN100C-XF3 performs better in eliminating voiding when compared to any SAC-alloy.

The Cobar Group, part of Balver Zinn, can now offer a coherent system of SN100C soldering materials to the customer, ranging from solder bars to cored solder wire, compatible fluxes, and solder paste. Cobar also offers a complete range of SN100C-based Hot Air Leveling products for the board manufacturing industry.

About Cobar Europe

Cobar Europe, a member of the Balver Zinn Group, was founded in 1983 in Holland, and has been a recognized global supplier of solder paste, solder fluxes and related materials for electronics assembly. Cobar Europe BV is known in Europe as the leader in lead-free and VOC-free soldering materials. Cobar is accredited to the prestigious ISO/TS 16949 Quality Management Standard. The Cobar Group includes Cobar Europe BV in Breda, Holland, Cobar Solder Products Inc. in Londonderry, NH, USA, plus several joint ventures and licensed manufacturing partnerships around the world.

Cobar Europe BV on the Internet: http://www.cobar.com

Balver Zinn on the Internet: http://www.balverzinn.com

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