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Nihon Superior and DfR Solutions� Lead-free Solder Reliability Paper to be Presented at IPC/JEDEC International Conference

Mar 09, 2008

OSAKA, JAPAN � March 6, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper with DfR Solutions, titled �Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,� to the Technical Conference that is part of the IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics scheduled to take place March 11, 2008 at the Sheraton Raleigh Hotel in Raleigh, North Carolina.

The paper will be presented by Keith Sweatman of Nihon Superior in conjunction with Joelle Arnold of DfR Solutions

Since the electronics industry first became aware that it would have to change to lead-free soldering technologies to meet the requirements of the EU�s RoHS Directive, there has been concern about criteria for the selection of alloys to replace the tin-lead solder on which the industry has previously relied. The paper being presented at the IPC/JEDEC International Conference identifies properties that are relevant to the performance of an alloy as a reliable, user-friendly and cost-effective lead-free solder.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, the company has made its mark by developing its own soldering materials and supplying them to the electronics industry. On the basis of its expertise in these technologies, Nihon Superior has developed a global business, establishing manufacturing and sales centers in Asia and forming business partnerships with companies in Europe, America and Asia.

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