IPC Sponsors Endicott Technology Interchange:

Mar 03, 2008

BANNOCKBURN, Ill., USA, February 26, 2008 � Technological advances on the horizon and future industry demands � this is the focus of �Will You Be Ready?: An Endicott Technology Interchange,� sponsored by IPC � Association Connecting Electronics industries�. On May 14, 2008, Endicott Interconnect Technologies, Inc. will open up its headquarters in Endicott, N.Y for a day of information exchange and networking in order to provide a vision of future direction and needs. In addition to presentations from key Endicott staff, a panel of major industry suppliers will provide projections for materials needs, imaging, design and test with an emphasis on advanced packaging and substrates.

The keynote address, �Leading Edge Technology: What Will Be Expected of the Supply Chain?,� by Voya Markovich, senior vice president and chief technology officer of Endicott Interconnect Technologies, Inc., will reveal the company�s customer-driven roadmap and future product requirements. Markovich will also outline the future demands on equipment manufacturers and material suppliers.

The morning session will also include presentations from top technologists who will discuss their expectations of the electronics industry supply chain. In the afternoon, four leading suppliers will address the industry�s readiness to meet these expectations. Gap analyses, focused on advanced packaging and substrates, will be presented in the areas of materials, imaging, design and test.

�The success of companies in the electronic interconnect industry depends on their ability to anticipate supply chain requirements,� said Susan Filz, IPC director of industry programs. �The purpose of this event is to bring the industry together to share information so that supply chain needs are met.�

For more information on the interchange, visit http://www.ipc.org/endicott or contact Miranda Tully, IPC coordinator of industry programs, at +1 847-597-2879 or MirandaTully@ipc.org.

About IPC

IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

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