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Henkel Introduces Dispensable Phase Change Thermal Interface Material

Feb 28, 2008

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

PowerstrateXtreme Dispensable has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks. The material is also re-workable and repeatable making it especially cost-effective for both lidded and bare die processor applications.

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