SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Henkel Electronic Materials


Henkel Introduces Dispensable Phase Change Thermal Interface Material

Feb 28, 2008

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

PowerstrateXtreme Dispensable has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks. The material is also re-workable and repeatable making it especially cost-effective for both lidded and bare die processor applications.

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