SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Henkel Introduces Dispensable Phase Change Thermal Interface Material

Henkel Introduces Dispensable Phase Change Thermal Interface Material

Feb 28, 2008

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

PowerstrateXtreme Dispensable has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks. The material is also re-workable and repeatable making it especially cost-effective for both lidded and bare die processor applications.

Mar 06, 2017 -

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Mar 01, 2017 -

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Feb 23, 2017 -

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Jan 24, 2017 -

Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017

Sep 21, 2016 -

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

May 11, 2016 -

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award

May 09, 2016 -

Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America

Mar 30, 2016 -

Henkel Develops Thermally Conductive Technomelt® Solution

Mar 27, 2016 -

New Technomelt® Material Streamlines Substrate Coating Processes

Mar 23, 2016 -

Benoit Pouliquen to Lead Electronics Business of Henkel Adhesive Technologies

48 more news from Henkel Electronic Materials »

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

See electronics manufacturing industry news »

Henkel Introduces Dispensable Phase Change Thermal Interface Material news release has been viewed 801 times

  • SMTnet
  • »
  • Industry News
  • »
  • Henkel Introduces Dispensable Phase Change Thermal Interface Material
reflow oven profiler

pcb components vacuum pick up