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Henkel�s Loctite� 3508 CSP Underfill Delivers Lead-Free Compatibility and Self-Centering Capability

Feb 28, 2008

Loctite� 3508 is a one component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Unlike capillary flow underfills which require dedicated equipment and subsequent process steps, Henkel�s Loctite 3508 can be applied in-line using existing capital equipment with curing taking place during the normal solder reflow process, thus delivering considerable cost savings and dramatically improving throughput. The material allows for device self centering, is lead-free compatible, reworkable and is remarkably stable with a pot life of greater than 30 days.

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