SMT, PCB Electronics Industry News

3D/SiP Advanced Packaging Symposium Registration Open

Feb 22, 2008

The SMTA is pleased to announce its spring packaging symposium. The 3D/SiP Advanced Packaging Symposium will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC.

SMTA�s 3D/SiP Advanced Packaging Symposium will cover a wide range of application opportunities assessing the market, technology and business implications of three dimensional assembly technologies at both the package and product levels. Topical coverage runs the gamut from chip stacks and origami semiconductor packaging through package on package (PoP) board level assembly. Speakers review technical, business and intellectual property aspects of 3D packaging and assembly for products ranging from consumer and commercial to military and medical devices leading to a better understanding of potential matches between various 3D technologies and specific product applications.


  • April 28th - Half-day tutorial on �3D Packaging Applications, Requirements, Infrastructure and Technologies� led by Lee Smith of Amkor Technology

  • April 29th - Keynote address by Dongkai Shangguan, Flextronics

  • April 29th � Welcome Reception

  • April 30th - Keynote address by Judy Priest, Cisco Systems

If you are interested in group discounts or have any other questions on this program, please contact Melissa Serres at or 952-920-7682. For registration and more information on the SMTA 3D/SiP Advanced Packaging Symposium please visit the website:

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Mar 13, 2018 -

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Feb 27, 2018 -

Seeking Student Applications for 2018 Grant and Scholarship Opportunities

Feb 25, 2018 -

Phil Zarrow to Present SMTA Capital Chapter Tutorial Program

Feb 22, 2018 -

Latest Conference Proceedings Now Available in SMTA Knowledge Base

Feb 19, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program

Feb 08, 2018 -

SMTA Announces 2018 Certification Program Offerings

Feb 07, 2018 -

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter Tutorial Program

Feb 06, 2018 -

Electronics in Harsh Environments Conference Program Finalized

Feb 02, 2018 -

IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017

Feb 02, 2018 -

SMTA “Members of Distinction” Award Winners Announced

583 more news from Surface Mount Technology Association (SMTA) »

Mar 19, 2018 -

Techcon Introduces New Valve Controllers for the Smart Factory

Mar 16, 2018 -

Ersa Announces Versaflow 3 Application Training Course in April

Mar 16, 2018 -

Press preview for Seica ATE SEMINAR 20th February 2018, Daniel Hotel Herzliya, Israel

Mar 16, 2018 -

Henkel Develops Non-Proprietary Solder Paste Analysis Toolkit for Modern Process Complexities

Mar 16, 2018 -

Libra Industries Promotes Clayton Carr to Program Manager

Mar 16, 2018 -

ZESTRON to Exhibit at SMTA Intermountain Expo and Tech Forum

Mar 14, 2018 -

Jigar Patel to Present at Workshop in Vancouver, Canada

Mar 14, 2018 -

IPC Volunteers Honored for their Contributions to the Electronics Industry at IPC APEX EXPO 2018 More than 300 awards presented

Mar 14, 2018 -

Nordson ASYMTEK Wins its 14th Service Excellence Award

Mar 14, 2018 -

IPC Issues Call for Participation for IPC APEX EXPO 2019

See electronics manufacturing industry news »

3D/SiP Advanced Packaging Symposium Registration Open news release has been viewed 923 times

x-ray inspection

PCB Assembly Equipment Auctions