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Dr. Jennie Hwang to address BGA Lead-free Reliability and Harsh Environment Electronics

Jan 25, 2008

In compliance with global RoHS and in an effort to maximize reliability and to lower cost, Dr. Hwang leverages on the confluence of in-depth knowledge and real-world experiences to address lead-free reliability in two separate sessions.

AM Session - Lead-free Reliability for Harsh Environment Electronics. The seminar emphasizes provocative questions and answers regarding lead-fee reliability. Whether the lead-free is reliable enough for harsh environment electronics will be rationalized by addressing twenty key questions.

PM Session - BGA Reliability in Lead-free Packaging & Assembling. This course addresses critical questions and tackles prevalent issues related to Lead-free BGA packages and assemblies: "What are potential BGA lead-free issues?"; "Should BGA solder balls become molten during reflow?"; "How the process affect the production yield?"; "How the process affect the assembly reliability?"; "Can SAC ball and SnPb solder paste or vice versa work well?"; "Can SAC ball and other Pb-free solder paste work well?"; "Can SAC ball and SAC solder paste work for harsh environment electronics?"; What it takes to produce acceptable lead-free BGA assemblies?"; and "What it takes to produce the reliable lead-free BGA assembly for harsh environment electronics?"

March 11, 2008 in Boston, MA

May 14, 2008 in San Diego, CA

For info contact jamien@blackfox.com or Tel: +1 888.837.9959

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