AM Session - Lead-free Reliability for Harsh Environment Electronics. The seminar emphasizes provocative questions and answers regarding lead-fee reliability. Whether the lead-free is reliable enough for harsh environment electronics will be rationalized by addressing twenty key questions.
PM Session - BGA Reliability in Lead-free Packaging & Assembling. This course addresses critical questions and tackles prevalent issues related to Lead-free BGA packages and assemblies: "What are potential BGA lead-free issues?"; "Should BGA solder balls become molten during reflow?"; "How the process affect the production yield?"; "How the process affect the assembly reliability?"; "Can SAC ball and SnPb solder paste or vice versa work well?"; "Can SAC ball and other Pb-free solder paste work well?"; "Can SAC ball and SAC solder paste work for harsh environment electronics?"; What it takes to produce acceptable lead-free BGA assemblies?"; and "What it takes to produce the reliable lead-free BGA assembly for harsh environment electronics?"
March 11, 2008 in Boston, MA
May 14, 2008 in San Diego, CA
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