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Indium Corporation VP Presents at Pan Pacific Microelectronics Symposium

Dec 27, 2007

Indium Corporation�s Vice President of Solder Products Business Unit, Ross Berntson, will present a workshop on �Full Metal TIMs� at the Pan Pacific Microelectronics Symposium & Tabletop Exhibition in Kauai, Hawaii on 22-24 January 2008.

�Full Metal TIMs� will explore the handling of liquid, compressible, and phase change metals as thermal interface materials (TIM), and their appropriate application for reliable performance. Metal TIMs offer substantially high thermal conductivity and low thermal interface resistance, enabling the design of smaller and higher power electronic devices.

Sponsored by the SMTA, the 13th Annual Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.

Ross joined Indium Corporation in 1996. As Vice President of Solder Products Business Unit, he manages Indium�s extensive line of solder materials including sales, service, production, and development. Ross has a Bachelor�s degree in Chemistry, a Master�s degree in Teaching, and an MBA, all from Cornell University, where he graduated with honors.

Ross is based at Indium�s global headquarters in Clinton, NY, USA and resides in Whitesboro, NY.

Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication & packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner, and registered to ISO-9001.

For more information about Indium Corporation visit http://www.indium.com or email abrown@indium.com.

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