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Nihon Superior to Present During the 2008 Pan Pac Symposium

Dec 19, 2007

OSAKA, JAPAN � December 17, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the 13th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that is scheduled to take place January 22-24, 2008 at the Sheraton Kauai Resort, in Kauai, Hawaii.

Nihon Superior�s presentation will take place during Session WA1 in the Mechanical Integrity of Assemblies tract from 9 to 10:30 a.m. The paper, �Strength of Lead-Free BGA Spheres in High-Speed Shear Loading,� will be presented by Keith Sweatman, Shoichi Suenaga and Tetsuro Nishimura on Wednesday, January 23, 2008.

The Pan Pacific Microelectronics Symposium & Tabletop Exhibition promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Sponsored by the Surface Mount Technology Association (SMTA), the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, the company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. Backed by its knowledge of these technologies, Nihon Superior has developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and China, and by forming business partnerships with overseas companies.

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