Said to be a significant step-up from labor-intensive manual methods of soldering and desoldering, system 855�s profiling adjustments include push-button settings for temperature, air flow volume and duration. Control of these variables enables the low-volume user to replicate recommendations of solder paste manufacturers. When activated, the unit proceeds automatically through its three preheating zones and two reflow zones before auto shutoff when the cycle is completed. Up to 10 profiles can be stored in the system memory.
The 855�s temperature range of up to 350�C meets the high thermal demands of lead-free processing. Accuracy is ensured by an included external thermocouple on the PCB while an adjustable ceramic underheater gently acclimates the PCB to rising temperatures, preventing board warpage.
The production cycle begins as a heating nozzle is attached to the head, and then z-lowered onto the component. When reflow is complete, the head is automatically lifted, as solder residue is cleared.
The 6-Pc. unit, Internet-priced at $4,450, includes process controller, PCB retention fixture, hot air wand, vacuum suction pen, adjustable ceramic underheater and cool-down fan. For details, access https://www.manncorp.com/specialty-soldering-equipment/855-solder-rework-station/