SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Finetech

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Nov 27, 2007

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

This is relevant when an AuSn bonded laser bar module must be assembled on further substrates such as TO-sockets, submounts or heat sinks. The second process should run with lower temperatures to avoid affecting the AuSn bond line and to keep the thermal stress on the assembly as low as possible. An Indium process is running with temperatures even lower than 200�C.

FEMTO is capable to employ process gases like nitrogen, inert gas and formic acid. The system marks a breakthrough by combining high placement accuracy (+/-0.5 micron), large working area (maximum die size up to 4� diameter, substrate size up to 6� diameter) and process flexibility within an automated bonding system capable of handling various assembly technologies, not only limited to laser bar bonding.

With its open system architecture, FINEPLACER� FEMTO can be easily adapted with specific additional modules which allow an outstanding multitude of applications and processes.

The newly developed high speed bottom heater for FEMTO is suitable for the AuSn process and was especially developed for small components (integrated 2 inch tray holder) with sensitive structures and strong time demands. Features are temperatures up to 400�C, a max. temperature ramp of 100�K/s and capability of rapid cooling. Other FINEPLACER� bonding systems can also be equipped with this high speed heater.

FINEPLACER� FEMTO is designed to keep the cost of ownership low and is the perfect fit for both the production environment and the process/product development.

More information is available at


FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

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