Nov 27, 2007 
Due to its modular system architecture, FINEPLACER� Micro MA offers an exceptionally high grade of flexibility. Depending on the specific requirements, the machine can be equipped with a broad range of application modules to support a multitude of assembly technologies such as AuSn/Indium/C4 soldering, thermocompression, ultrasonic and thermosonic bonding, adhesive technologies (ACF, ACP, NCP) or curing (UV, temperature).
Typical applications for FINEPLACER� Micro MA are RFID and sensor assembly, flip chip bonding, chip-on-flex, chip-on-glass, embedded components or chip-to-wafer bonding. With an optional Die Pick-up Module it is even possible to work with 8� wafers.
Optionally available is a motorized Bonding Force Module which is controlled by the bonding software �WinFlipChip�. Critical process steps will be carried out operator-independent � at the same time there is an increase in reproducibility and usability.
Because of the platform concept FINEPLACER� Micro MA can be enhanced with powerful soldering modules to turn the system into a high-performance rework station. This makes it the perfect choice for universities and research facilities.
More information available at http://www.finetech.de
About FINETECH:
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.
