SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Nov 08, 2007

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.

EI assisted Northrop Grumman�s Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.

�The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,� explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. �This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI�s wire bond PBGA organic materials, packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.�

About Northrop Grumman

Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide.

http://www.st.northropgrumman.com

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

15 more news from i3 Electronics »

Sep 24, 2017 -

Europlacer Shows Printer at Productronica India – Just!

Sep 24, 2017 -

Microtronic GmbH Appoints Distributor for the LBT210 & ConTTest Systems in Spain and Portugal

Sep 24, 2017 -

INTERFLUX® Electronics Completes Testing on New Alloy at Ersa Demo Room

Sep 24, 2017 -

CyberOptics Launches Coordinate Measurement Software Suite for New High Speed SQ3000™ CMM System

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

See electronics manufacturing industry news »

Endicott Interconnect Technologies' Wire Bond Product Launched into Space. news release has been viewed 1235 times

  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies' Wire Bond Product Launched into Space.
KIC SPS Smart SMT Reflow Oven Profiler

PCB Soldering Tools