SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Infrared Start Sensor for Touchless Board Temperature Measurement

New Infrared Start Sensor for Touchless Board Temperature Measurement

Oct 29, 2007

At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.

Perfect rework results are only possible when all parameters of the heating process can be reproduced reliably. For thick multilayers it is also possible to integrate software-controlled bottom heating into the process. However, the temperature of the PCB may vary under different external factors of influence. To carry out bottom heating processes, based on different initial board temperatures, would have an influence on the results if the starting point of the top heat process was not adapted. Therefore, it is recommended to use the start sensor to ensure the process can be exactly reproduced under all circumstances.

Compared to conventional temperature measurement directly at the PBC, the new infrared start sensor offers several benefits: no in-process handling is needed during the process due to contactless infrared measurement and a laser pointer helps in finding the best measuring spot.

The infrared start sensor is characterised by an outstanding profile reliability of +/- 5 �C and allows for increased peak temperature accuracy. The PCB is only exposed to as much heat as is necessary to reduce thermal stress significantly.

Of course, existing placer control boxes can also be retrofitted with the infrared start sensor.

About FINETECH

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

See electronics manufacturing industry news »

New Infrared Start Sensor for Touchless Board Temperature Measurement news release has been viewed 596 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Infrared Start Sensor for Touchless Board Temperature Measurement
Non-heated dispensing system

Capillary Underfill process