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Finetech to Demonstrate Compact Rework System at Nepcon East 2007

Oct 23, 2007

Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.

The Fineplacer� CRS 10 is designed specifically for customers needing a quick set up and easy operation for rework. The system is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards. Applications include BGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small passives, connectors, RF-shields, shielding frame, flip chip rework as well as customized applications.

The rework station features a Plug-and-Work design, eliminating the need for time-consuming cabling. Additional features include a patented Vision Alignment System with stationary beam splitter, controlled Z-height during reflow, proven soldering head technology, and an automated component place and lift-off function. The Fineplacer� CRS 10 is equipped with a sophisticated reflow module for top heating and high-performance full-area bottom heating.

Very high accuracy (better than 10 �m placement accuracy) allows the system to be used for the smallest components with pitches down to 100 �m. On the other hand, the large field of view makes it possible to align large components, e.g., Super BGAs with side lengths of up to 45 mm, without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". In addition, the system is lead-free approved.

About Finetech

Finetech is a leading manufacturer of innovative Rework and Micro Assembly equipment for the latest advanced packages. The core businesses of Finetech are devoted to the fields of precision Component Placement, Flip Chip and Opto-electronic Bonding and SMT Rework. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

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