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International Exhibition and Conference for Electronic Packaging and Assembly Technology 2008

Oct 06, 2007

Date: Nov.4-6 2008

Venue: INTEX Shanghai,China

Official Website: http://www.chinasmtforum.com

Rapid developments in the industry and consumer demands generate electronic products that are characterized by smaller-size, high functionality and increased reliability. These trends require constantly new components which are produced by new packaging technologies.

With the packaging size getting increasingly smaller, there will be a need for the assembling equipment to catch up with more precise and advanced technology in order to meet the new manufacturing standards. The gap between the suppliers of electronic assembly equipment and the semiconductor industry is going to become more and more smaller, forced by the increasing exchange of technology developments in both sectors.. For example, new packaging technologies like BGA, CSP, etc., are effecting the development of Surface Mount Devices which are one of most important driving forces for innovations in the SMT field.

Environmental protection will also set new trends for the industries development. Especially Photovoltaic and LED products will raise the demand for electronic devices and new packaging technologies in China. And all these new products will need OEM and ODM to improve their capabilities on a higher manufacturing level.

In order to meet these industrial trends, BMC will present the China SMT Forum 2008 at the INTEX Shanghai from November 4-6, 2008. At the conference and the co-located exhibition for electronic packaging and assembly technology, you will meet your suppliers and clients, specialists and key people from science and industry in packaging and assembling fields.

For more information, please do not hesitate to contact me at Tel: (86) 21 5169-3230, Fax: (86) 21 6427-6277 or email: kelly.zhu@businessmediachina.com

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