IMAPS and China Electronics Packaging Society Sign Memorandum of Cooperation

Washington, D.C. - June 12, 2007 - During a visit to China in April, IMAPS First Past President Jim Drehle and IMAPS President Elect Steve Adamson met with Professor BI Keyun, President of CEPS, China Electronics Packaging Society, and of CIE, China Institute of Electronics. Discussions were held concerning potential cooperation and a Memorandum of Cooperation was developed. The Memorandum was reviewed and subsequently approved by the Executive Council of IMAPS.

Highlights of the Memorandum of Cooperation:

• Each party has agreed to work together to build a mutually beneficial inter-society relationship.

• Each society will recognize the other as one of the technical participants in their international conferences and symposia (ICM, ICPT and IMAPS) in the electronic packaging field. Each society will exchange Call for Papers for review.

• IMAPS will coordinate its China Chapter activities with CIE-CEPS. Each society will send a delegation or representative to the international conferences and arrange a session as appropriate. The leadership of IMAPS looks forward to welcoming the CIE-CEPS delegation to the 40th International Symposium on Microelectronics in San Jose, California, November, 2007.

• Mr. Adamson and Mr. Drehle are available for interviews to discuss the goals of this Agreement. Please contact Ann Bell, 202-548-8717 or abell@imaps.org to arrange for a time and place.

About IMAPS

The International Microelectronics And Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system