SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IMAPS and China Electronics Packaging Society Sign Memorandum of Cooperation.

IMAPS and China Electronics Packaging Society Sign Memorandum of Cooperation.

Jun 13, 2007

During a visit to China in April, IMAPS First Past President Jim Drehle and IMAPS President Elect Steve Adamson met with Professor BI Keyun, President of CEPS, China Electronics Packaging Society, and of CIE, China Institute of Electronics. Discussions were held concerning potential cooperation and a Memorandum of Cooperation was developed. The Memorandum was reviewed and subsequently approved by the Executive Council of IMAPS.

Highlights of the Memorandum of Cooperation:

  • Each party has agreed to work together to build a mutually beneficial inter-society relationship.
  • Each society will recognize the other as one of the technical participants in their international conferences and symposia (ICM, ICPT and IMAPS) in the electronic packaging field. Each society will exchange Call for Papers for review.
  • IMAPS will coordinate its China Chapter activities with CIE-CEPS. Each society will send a delegation or representative to the international conferences and arrange a session as appropriate. The leadership of IMAPS looks forward to welcoming the CIE-CEPS delegation to the 40th International Symposium on Microelectronics in San Jose, California, November, 2007.
  • Mr. Adamson and Mr. Drehle are available for interviews to discuss the goals of this Agreement. Please contact Ann Bell, 202-548-8717 or abell@imaps.org to arrange for a time and place.

The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers 69 chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia. Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.

Jun 23, 2010 -

IMAPS Announces Keynote Speakers for IMAPS 2010.

Aug 22, 2006 -

The IMAPS Global Business Council Announces 2006 Marketing Forum Program.

Jun 20, 2006 -

IMAPS 2006 to Feature Three Regionally-Focused Plenary Sessions.

Mar 19, 2001 -

IMAPS' Comprehensive Industry Guide Available Online

Mar 13, 2001 -

IMAPS 2001 Exhibits Nearly Sold Out!

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

IMAPS and China Electronics Packaging Society Sign Memorandum of Cooperation. news release has been viewed 1070 times

  • SMTnet
  • »
  • Industry News
  • »
  • IMAPS and China Electronics Packaging Society Sign Memorandum of Cooperation.
 Reflow System

PDR - SMD / BGA Rework