SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M

Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M

Mar 27, 2007

ENDICOTT, NY, March 23, 2007�The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc. multiple contracts totaling $164M to produce card frame assemblies including organic semiconductor packaging, module assemblies, printed circuit boards, full functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. EI also provided an innovative and cost effective logistics, shipping and storage solution to the DoD customer in support of this important endeavor.

EI initially recommended its HyperBGA� organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.

Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.

Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.

"Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business," said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. "Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid," he continued.

"It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs," stated the DoD customer.

"The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer�s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements," commented James J. McNamara, President and CEO at EI. "And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof."

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, aerospace and defense, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com

Company Contact:

Theresa Taro

Director of Marketing and Communications

Phone: (607) 755-1847

Theresa.Taro@eitny.com

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

15 more news from i3 Electronics »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M news release has been viewed 1071 times

  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M

Selective Conformal Coating System - GPD SimpleCoat