SMT, PCB Electronics Industry News

Tool for total defect detection in PCBs demonstrated

Mar 16, 2007

An EU collaboration between EU companies and research organisations, known as Microscan, has been working to produce a powerful tool in the total quality control of Printed Circuit Board (PCB) assemblies. The consortium has just completed a first demonstration of proof in principle at TWI Technology Centre (Port Talbot, Wales).

The development comprises four modules each based on a different non destructive detection technique:- Automated Optical Imaging (AOI), Digital Radiography (DR), Thermography and Scanning Acoustic Microscopy (SAM). Although some of the techniques are already used in industry, with the exception of AOI, they are typically used offline and consequently can only be used to conduct batch tests with limited defect detection capability. Additionally, AOI is also currently limited to line-of-sight inspection and cannot be applied to hidden joints and devices/features (e.g. ball grid array packages, integrated passives and vias in multi-layer boards). Other defects, such as plastic encapsulated delamination and heat plane delamination, can only be detected reliably with SAM and active thermography.

"This is the first time that the combined benefits of the four techniques have been utilised in an in-line environment to enable a 100% defect detection coverage" said Dr Ian Nicholson, principal scientist at TWI Ltd. "Depending on any given PCB configuration that is to be inspected, the inspection modules have been designed for in-line flexibility from the outset so that they can be used independently of each other, together or interchanged to give the best results in terms of inspection coverage and inspection throughput" he added.

The work is as a result of a two year European Framework 6 project shared between 10 organisations with TWI as the lead partner. The partners plan to exploit the knowledge they have gained through the collaboration and commercialise the prototype modules within two years.

More information about the project and project partners can be found at

Jun 24, 2018 -

Press preview for Seica Inc. participation at Semicon West, July 10-12 2018, Booth 509, San Francisco, CA.

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -


Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

See electronics manufacturing industry news »

Tool for total defect detection in PCBs demonstrated news release has been viewed 4 times

 Reflow System

FPC* - Fluid Pressure Control - Dispensing Pump