SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from i3 Electronics


Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure

Jan 05, 2007

Warren Dannelly, Director of Sales, Global Accounts

Warren Dannelly, Director of Sales, Global Accounts

Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.

Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.

Mr. Dannelly�s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.

�As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,� commented Michael Hills, Senior Vice President of Sales and Account Services at EI. �I believe Warren�s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,� he continued.

Warren is based in Louisville, Kentucky where he lives with his wife and two children.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

You must be a registered user to talk back to us.

More News from i3 Electronics

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

(16) more news from i3 Electronics

Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure news release has been viewed 796 times

Plasma Prior to Conformal Coating

PCB Buffers