SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from i3 Electronics


Technological Leadership Continues to Differentiate Endicott Interconnect

Dec 05, 2006

Endicott Interconnect Technologies, Inc. recently celebrated the issuance of its 27th U.S. Patent since becoming an independent company just four years ago. EI, which ranks 13th among the top U.S. PCB companies in revenues (Printed Circuit Design & Manufacture, September, 2006), is led by only three of those companies in PCB related issued patents. The firm�s impressive patent portfolio covers innovative substrate designs and manufacturing processes and is strong evidence of EI�s technical expertise in this very competitive area. Already, EI owns more issued U.S. Patents relating to PCB�s than many of its main competitors, including Sanmina-SCI, Viasystems, Merix, M-Flex, TTM Technologies, Innovex, Photocircuits and DDi.

EI�s expertise in electronic packaging substrates stems from the know-how of innovative technologists. The company�s heritage has provided a long history of technological advancements that continues today with EI�s top 11 patent holders accounting for over 700 patents combined. They include; Voya Markovich (171), Kostas Papathomas (154), John Lauffer (83), Robert Japp (59), Frank Egitto (55), Luis Matienzo (49), James Wilson (40), Thomas Miller (33), Benson Chan (32), John Kresge (32) and Mark Poliks (32).

�EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. This technical leadership has been accomplished through the creativity and invention of our talented personnel,� commented James J. McNamara, President and CEO at EI. �This innovation is a key to EI�s success in the advanced packaging arena and clearly differentiates us from our competitors,� he continued.

Technical leadership is further exemplified by EI technologists through collaboration with universities, consortia and leadership roles within industry organizations. How Lin serves as an Adjunct Professor at Binghamton University and Jeff Knight is the Advanced Packaging Committee Chair for the Electronic Components and Technology Conference (ECTC).

Voya Markovich is Chair of the Interconnect Section for the Electronic Components and Technology Conference (ECTC), President of the International Microelectronics and Packaging Society (IMAPS) New Jersey Chapter, and a member of the industrial and executive boards for the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM) and the Watson School of Engineering and Applied Science at Binghamton University.

Mark Poliks is the Electronic Components and Technology Conference (ECTC) Materials/Processing Section Co-Chair, a Research Professor at Binghamton University, Northeast Regional Program Chair for the American Chemical Society, Advisory Board Member of the Integrated Electronics Engineering Center (IEEC) and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM).

Additionally, EI technologists including Benson Chan, Frank Egitto, Mark Poliks, Roy Magnuson, Mike Rowlands, Luis Matienzo, How Lin and Vara Calmidi recently taught a course in Flexible Electronics at Cornell University.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

You must be a registered user to talk back to us.

More News from i3 Electronics

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

(16) more news from i3 Electronics

Technological Leadership Continues to Differentiate Endicott Interconnect news release has been viewed 858 times

Boundary Scan

PCB equipment