SMT, PCB Electronics Industry News

Free Webcast on the Rework and Repair of Lead-Free Solder Joints

Oct 19, 2006

The elimination of the heavy metal lead (Pb) from electronic products will drive not only the need to change the manufacturing processes but also the associated rework and repair processes. Although there are many methods defined to rework and repair electronic products, certain parameters will be consistent and must be thoroughly understood to create a reliable process that will provide the customer with a quality product.

Although your products may have initially been designed for and processed with lead-bearing solder alloys, the newly created lead-free alloys now have a different liquidus temperatures and will have more mass than the initial solder joint with different thermal requirements. The marking of products with special material identification as defined in IPC-1066 and JESD-97 to process materials used for assembly will also be critical for the rework/repair centers as they need to know what materials and alloys were used to assemble the product. This session will review these elements along with laminate conditions as they will also be impacted by the higher temperature profiles.

Register at: http://www.eptac.com/rohs-weee/randr.html

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