The agenda also included presentations by Dr. Claudius Ferger, Manager of Advanced Plastic Packaging at IBM�s Thomas J. Watson Research Center, Dr. Ning-Cheng Lee, Vice President of technology at Indium Corporation, and Dr. Ronald C. Lasky, Senior Technologist at Indium Corporation.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics and semiconductor assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.