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Indium Corporation�s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to Present at Lead-Free Workshop

Sep 28, 2006

Dr. Lee�s presentation will be on the topic of lead-free system compatibility. Dr. Lasky will be speaking on applying SPC to surface mount manufacturing.

The workshop, sponsored by SMT Magazine and RIT�s Center for Electronics Manufacturing and Assembly (CEMA), will focus on lead-free rework and epair; failure analysis technologies for process engineers; tin whisker mitigation; lead-free system compatibility; IPC-7711 certification; and RoHS traceability, certification, and compliance.

Dr. Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost ownership.

Dr. Lasky, holder of the prestigious SMTA Founder�s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 20 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures.

Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information and to sign up for the workshop, visit http://www.smtmag.com

For more information about Indium Corporation visit http://www.indium.com or email askus@indium.com.

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