Among the initial tasks facing the new Director of Program Management, Military and Defense Programs is to establish and maintain working relationships with subcontractors, suppliers and business unit managers, assuring unified efforts and communication of program status to EI customers.
Mr. Hills brings 20 years experience in the electronics industry in a variety of program and product management roles, most recently as Principal Business Development Manager for Rockwell Collins, Simulation and Training Solutions Group. He has particular expertise supporting and facilitating military business acquisition activities within the electronic packaging arena.
�I�m very pleased with the addition of Eric to our team,� commented James J. McNamara, President and CEO at EI. �His extensive background in leadership roles with world-class companies coupled with an impressive track record in the military industry, ideally suits Eric to drive our growing defense and aerospace business.�
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a worldclass supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-tomarket advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.
Director of Marketing & Communications
Phone: 607 755-1847
Fax: 607 755-1187