SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. to Showcase Innovative Semiconductor Packaging Solutions at SEMICON West 2006

Endicott Interconnect Technologies, Inc. to Showcase Innovative Semiconductor Packaging Solutions at SEMICON West 2006

Jul 12, 2006

Endicott Interconnect Technologies, Inc. today announced they will exhibit semiconductor packaging solutions at SEMICON West 2006, the premier exposition in the US dedicated to the global semiconductor and microelectronics

industries. The exhibition takes place at the Moscone Center, San Francisco, California,

July 10th-14th. Organic substrates and assembly solutions will be on display in the EI booth, #5484C in the NY Loves Nanotech pavilion.

�SEMICON West is the ideal venue to showcase our enabling technologies and engineering expertise to prospective customers,� commented James J. McNamara Jr., President and CEO of EI. �EI has seen tremendous growth this year and continues to

invest in equipment to upgrade and expand our capacity and capabilities because we are

committed to retaining our leadership position in the advanced packaging arena,� he added.

EI�s powerful line of high performance semiconductor packaging offerings includes

HyperBGA�, CoreEZTM and Wire Bond PBGA. EI will also showcase its printed circuit board fabrication, 1st and 2nd level assembly solutions.

HyperBGA� is a flouropolymer-based (PTFE), organic flip chip package designed to meet the needs of high performance applications such as networking, high end servers, telecommunications, military and medical where speed, reliability and increased signal I/O, along with reduced weight and package size are critical. This low stress flip chip laminate package is also ideally suited to graphics applications that require high data

processing speeds or any application requiring a system-in-package (SiP) approach.

CoreEZTM utilizes the HyperBGA� manufacturing platform to offer organic, thin core build-up, flip chip technology that combines exceptional electrical, reliability and wireability performance with cost effective materials and processes. This package is perfect for applications requiring low cost build-up materials along with high performance. It is also an excellent choice for aerospace applications requiring radiation tolerance.

In continuing efforts to expand the market place for CoreEZTM, EI entered into a Memorandum of Understanding with Meadville Technologies Group Ltd. to produce CoreEZTM organic substrates at their Shanghai Meadville Science & Technology Ltd., Silicon Platform facility and qualification builds are currently underway.

EI�s Wire Bond PBGA offers superior electrical performance combined with material properties that are matched to the PCB, allowing it to deliver high overall performance and field reliability. The chip-up design is extremely economical and targets lower power applications while the cavity package provides excellent thermal performance.

Company representatives from sales, engineering and R&D will be available to discuss EI product lines as well as the distinct benefits of the company�s vertically integrated structure, facilitating one-stop-shopping for advanced electronic packaging needs.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a worldclass

supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust

manufacturing operations are critical for success. With more than 40 years experience in

providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-tomarket advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

15 more news from i3 Electronics »

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Rework and Professional Soldering from Ersa SMTA Guadalajara Expo

See electronics manufacturing industry news »

Endicott Interconnect Technologies, Inc. to Showcase Innovative Semiconductor Packaging Solutions at SEMICON West 2006 news release has been viewed 1852 times

  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies, Inc. to Showcase Innovative Semiconductor Packaging Solutions at SEMICON West 2006
SMT in-printer dispensing

 Reflow System