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Endicott Interconnect Technologies, Inc. to Showcase Innovative Semiconductor Packaging Solutions at SEMICON West 2006

Jul 12, 2006

Endicott Interconnect Technologies, Inc. today announced they will exhibit semiconductor packaging solutions at SEMICON West 2006, the premier exposition in the US dedicated to the global semiconductor and microelectronics

industries. The exhibition takes place at the Moscone Center, San Francisco, California,

July 10th-14th. Organic substrates and assembly solutions will be on display in the EI booth, #5484C in the NY Loves Nanotech pavilion.

�SEMICON West is the ideal venue to showcase our enabling technologies and engineering expertise to prospective customers,� commented James J. McNamara Jr., President and CEO of EI. �EI has seen tremendous growth this year and continues to

invest in equipment to upgrade and expand our capacity and capabilities because we are

committed to retaining our leadership position in the advanced packaging arena,� he added.

EI�s powerful line of high performance semiconductor packaging offerings includes

HyperBGA�, CoreEZTM and Wire Bond PBGA. EI will also showcase its printed circuit board fabrication, 1st and 2nd level assembly solutions.

HyperBGA� is a flouropolymer-based (PTFE), organic flip chip package designed to meet the needs of high performance applications such as networking, high end servers, telecommunications, military and medical where speed, reliability and increased signal I/O, along with reduced weight and package size are critical. This low stress flip chip laminate package is also ideally suited to graphics applications that require high data

processing speeds or any application requiring a system-in-package (SiP) approach.

CoreEZTM utilizes the HyperBGA� manufacturing platform to offer organic, thin core build-up, flip chip technology that combines exceptional electrical, reliability and wireability performance with cost effective materials and processes. This package is perfect for applications requiring low cost build-up materials along with high performance. It is also an excellent choice for aerospace applications requiring radiation tolerance.

In continuing efforts to expand the market place for CoreEZTM, EI entered into a Memorandum of Understanding with Meadville Technologies Group Ltd. to produce CoreEZTM organic substrates at their Shanghai Meadville Science & Technology Ltd., Silicon Platform facility and qualification builds are currently underway.

EI�s Wire Bond PBGA offers superior electrical performance combined with material properties that are matched to the PCB, allowing it to deliver high overall performance and field reliability. The chip-up design is extremely economical and targets lower power applications while the cavity package provides excellent thermal performance.

Company representatives from sales, engineering and R&D will be available to discuss EI product lines as well as the distinct benefits of the company�s vertically integrated structure, facilitating one-stop-shopping for advanced electronic packaging needs.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a worldclass

supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust

manufacturing operations are critical for success. With more than 40 years experience in

providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-tomarket advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com

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