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Reliability the Focus of Indium Corporation at Nepcon East/Electro

Apr 20, 2006

With the increasing demands for power and miniaturization driving thermal management issues, as well as SMT, CSP and PTH Reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a Process Engineer�s goal of optimizing finished goods reliability. This program is customer-driven, reliability-focused, and field-proven.

Indium�s Reliability product exhibit will feature NF260, the world�s first Reworkable, Pb-Free No-Flow Underfill and winner of the Global Technology Award, Vision Award and EM Asia Innovation Award, as well as the Indium5.1 series of Pb-Free No-Clean Solder Pastes.

Nepcon East/Electro is the only conference and exhibition in the Northeast where manufacturing professionals keep pace with global competition through solutions that make the electronics assembly process faster, better and less costly. Practical insights and hands-on demonstrations of the latest products and technologies make Nepcon East/Electro essential for professional success and business survival. For more information visit http://www.nepconeast.com

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information about Indium Corporation visit http://www.indium.com or email askus@indium.com.

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