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Third Annual Tin Whisker Workshop Scheduled for May 30 at ECTC

Apr 17, 2006

HERNDON, Va. and PISCATAWAY, NJ - April 17, 2006 - The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and the 56th Electronic Components and Technology Conference (ECTC). The workshop is scheduled for May 30, 2006, at ECTC in San Diego, Calif.

The workshop will provide participants an update on recent activities in both the testing and modeling of tin whiskers. In addition, a roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, "Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;" JEDEC/IPC joint publication JP002, "Current Tin Whiskers Theory and Mitigation Practices Guideline;" and JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes." The goal of the workshop is to help industry identify strategies to help assure that long lifecycle applications will not be subject to tin whisker failures.

The workshop is chaired by Ron Gedney, iNEMI consultant. Maureen Williams, mechanical engineer for NIST is co-chair. Dr. Henning Leidecker chief engineer of the Parts, Packaging and Assembly Technologies Office of NASA, will serve as moderator. For additional information about the workshop, visit:

"These workshops have proven valuable for bringing industry, government and academia together to share knowledge about, and expand our understanding of, tin whiskers," said Carol Handwerker, professor of materials engineering at Purdue University, who is the former chief of the Metallurgy Division at NIST and moderator of the first Tin Whisker Workshop. "The first workshop focused the efforts of the electronics community by clarifying our understanding of when and how whiskers grow. The second workshop assessed state-of-the art analytical techniques, such as focused ion beam (FIB), electron backscatter diffraction (EBSD) and wafer curvature, that could be used to separate the complex effects of stress, composition and structure on whisker formation. This workshop will discuss the risks that remain, based on our current understanding of how whiskers form, and how recent standards specifications are being implemented."

"As the commercial market moves towards environmentally friendly products free of lead, it becomes more important than ever for the industry to understand the tin whisker phenomenon," said Torsten Wipiejewski, ECTC program chair. "ECTC is a proud to once again host this timely and informative workshop."

About ECTC

The Electronic Components and Technology Conference (ECTC) is an international conference that brings together the best in packaging, components and microelectronic systems science, technology and education. Technical sessions focus on developments in several areas, including: electronic components, materials assembly, packaging, system packaging, optoelectronics, reliability, and simulation. Emerging technology sessions covering issues such as nanotechnology and biotechnology explore tomorrow's development's today. ECTC is sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and the Electronic Industries Alliance (EIA). For more information, visit

About iNEMI

The International Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit

About the IEEE CPMT Society

The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for professionals engaged in the research, design and development of advances in microsystems packaging and manufacture. Members include authorities in microelectronics, nanotechnology, semiconductor processing, materials and connector technologies at companies, universities, government research centers and allied enterprises around the globe. For additional information, visit

For further information:

Kristine Martin Cynthia Williams, iNEMI

IEEE CPMT Society +1 207-871-1260

+1 202 466 7391

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