Innovation Award at Nepcon Shanghai, China. Sponsored by EM Asia Magazine,
the Innovation Award recognizes, rewards, and celebrates excellence in the
Asian electronics industry. Indium�s NF260 No-Flow Underfill has also
earned the Global Technology Award at Productronica in November 2005 and the
Vision Award at APEX in February 2006.
NF260 is the world�s first Reworkable, Air Reflowable, Pb-Free No-Flow
Underfill. This remarkable product delivers increased reliability one order
of magnitude over the leading competitor and two orders of magnitude over
not using an underfill. CSP reliability is enhanced by addressing joint
cracking due to brittle Pb-Free alloys, and reduced joint size due to
miniaturization. It also provides cost savings and improved performance.
Designed for Pb-Free assembly, NF260 is fully compatible with the SMT
process and offers a wide process window to accommodate solder reflow and
underfill curing. The underfill curing is completed in one reflow pass and
no post-cure is required.
NF260 saves money by utilizing existing automated equipment and by enabling
processing in typical Pb-Free reflow profiles. It promotes excellent
wetting, low-voiding, and durability in thermal cycling. It also provides
the necessary strength to withstand the most rigorous drop tests, including
surpassing endurance expectations, with no failures after more than 450 drop
tests. Under similar conditions, unfilled soldered connections typically
fail after fewer than 10 drops.
NF220 is also available for SnPb applications.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier
of award-winning electronics assembly materials, including solder pastes,
solder preforms, fluxes, Pb-Free solder alloys, underfill materials,
die-attach materials, and more. The company is also the world�s premiere
supplier of commercial grade and high-purity indium. Factories are located
in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the
company is ISO 9001 registered.
To learn more about NF260 visit http://www.indium.com/nf260
or email firstname.lastname@example.org.