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Endicott Interconnect Technologies, Inc. to Display Powerful Line of Semiconductor Packaging Solutions at SEMICON Europa 2006

Apr 02, 2006

Endicott Interconnect Technologies, Inc. announced today that it will exhibit semiconductor packaging solutions at SEMICON Europa 2006, the premier exposition in Europe dedicated to semiconductor manufacturing technology. EI�s powerful line of high performance semiconductor packaging offerings includes HyperBGA�, CoreEZTM and Wire Bond PBGA. EI will also showcase its printed circuit board fabrication, 1st and 2nd level assembly solutions.

HyperBGA� is a flouropolymer-based (PTFE), organic flip chip package designed to meet the needs of high performance applications such as networking, high end servers, telecommunications, military and medical where speed, reliability and increased signal I/O, along with reduced weight and package size are critical. This low stress flip chip laminate package is also ideally suited to graphics applications that require high data processing speeds or any application requiring a system-in-package (SiP) approach.

CoreEZTM utilizes the HyperBGA� manufacturing platform to offer organic, thin core build-up, flip chip technology that combines exceptional electrical, reliability and wireability performance with cost effective materials and processes. This package is an excellent choice for applications requiring low cost build-up materials along with high performance. It is also nicely suited to aerospace applications requiring radiation tolerance.

In continuing efforts to expand the market place for CoreEZTM, EI recently entered into a Memorandum of Understanding with Meadville Technologies Group Ltd. to produce CoreEZTM organic substrates in high volumes at their Shanghai Meadville Science & Technology Ltd., Silicon Platform facility.

EI�s Wire Bond PBGA offers superior electrical performance combined with materials that are matched to the PCB, allowing it to deliver high overall performance and field reliability. The chip-up design is extremely economical and targets lower power applications while the cavity package provides excellent thermal performance.

Visitors to the booth can examine samples of EI�s organic substrates and assembly solutions and also discuss the distinct benefits of the company�s vertically integrated structure which facilitates one-stop-shopping for advanced electronic packaging needs.

SEMICON Europa 2006 takes place at the New Munich Trade Fair Center, Munich, Germany, on April 4-7, 2006. EI is in hall A2, booth #562C in the NY Loves Nanotech pavilion. EI will be joined in the booth by their European sales representative, NovaPack Technologies, experts in the design, marketing and sales of high frequency, high speed micro and opto electronics packaging.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

Company Contact:

Theresa Taro

Director of Marketing and Communications

Phone: (607) 755-1847

Theresa.Taro@eitny.com

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