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Endicott Interconnect Partners with Technology Neighbor To Achieve Maximum Throughput of Complex Assemblies

Dec 14, 2005

Endicott Interconnect Technologies, Inc., a world-class supplier of electronic interconnect solutions and turnkey manufacturing services, announced today that it has partnered with Universal Instruments Corp., Binghamton, NY, to automate and maximize production of very large, complex printed circuit cards and circuit board assemblies for its global clients. Endicott Interconnect is known for its technical expertise and comprehensive solutions tailored to clients with very sophisticated product requirements.

EI is now using Universal Instruments' Advantis Flip Chip placement system and Polaris Multi-process Assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier. With several hundred surface-mount components, several memory devices and a very large heat spreader, the product requires a production solution that can accommodate varied and complex component placement. The UIC equipment, along with component traceability, are fully-integrated into EI's production by software customized to the application by Universal's Systems Division.

"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick and place the larger components and sophisticated parts tracking," explained Raj Raj, Endicott Interconnect Senior Engineering Manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs. With Universal as a strategic partner, we will continue to develop innovative and effective solutions to our clients' future product challenges," he added.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnect solutions and electro/mechanical equipment. Endicott Interconnect product lines meet the needs of markets including IT and telecommunications, test equipment, defense and aerospace, medical, automotive and power management, where highly-reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading-edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about Endicott Interconnect Technologies and its products, please visit http://www.endicottinterconnect.com.

Company Contact:

Jeff Knight

Vice President, Business Development & Strategic Planning

Endicott Interconnect Technologies

Phone: (607) 755-1105

Email: Jeff.Knight@eitny.com

Media Contact:

Steve DeCollibus

PR Director

Phone: (401) 440-0042

Email: sdecollibus@eagleentertainment.com

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Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

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