Indium�s exhibit will offer a full range of Pb-Free assembly materials, including the first Reworkable Pb-Free No-Flow Underfill (NF-260) and its newest No-Clean Solder Paste (Indium5.1) with its industry leading response-to-pause printing. In addition, Indium will also feature other Pb-Free materials, such as Water-Wash Solder Pastes (Indium3.1), Solder Preforms in Tape & Reel Packaging, Wave Solder Flux for Pb-Free mixed-technology, and Rework & Repair materials.
Indium�s Pb-Free Suite of materials is backed by an award-winning Research & Development team and an experienced Pb-Free Implementation Support Center offering process proven solutions and staffed with one of the largest SMTA-Certified teams in the industry.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.