Sep 09, 2005
Indium�s exhibit will feature advanced technologies in Pb-Free electronics assembly with cutting edge materials, including Indium5.1, a Pb-Free No-Clean Solder Paste with industry leading �response-to-pause� printing, and NF260, the industry�s first Reworkable Pb-Free No-Flow Underfill. In addition, Indium�s exhibit will include a full range of PCB assembly materials, including solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.
Indium will be exhibiting at booth #5631. Experts will be readily available at the booth to answer questions on Pb-Free assembly. Articles and information will also be available.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit http://www.indium.com or email firstname.lastname@example.org.