SMT, PCB Electronics Industry News

Indium Corporation Appoints New Applications Engineers

Sep 04, 2005

Jim Hisert is new to Indium Corporation. He recently worked as a Mechanical Engineer at Fiber Instrument Sales in Oriskany, NY where he designed and patented a new fiber optic sensor. In his new role, he will focus on developing and supporting Indium�s Semiconductor Assembly Products. Jim has a degree in Mechanical Engineering from SUNY Institute of Technology.

Dan McCall started with Indium Corporation in 2004 as a Manufacturing Engineer. He now joins the Technical Support Department as an Applications Engineer where he will provide technical support to customers for fabricated

solder products. He has a degree in Mechanical Engineering Technologies from SUNY Institute of Technology.

Ed Briggs has been with Indium Corporation since 1990 and was most recently a Supervisor for Indium�s solder paste flux production. As an Applications Engineer, Ed will be responsible for providing internal email and telephone

support. He will also manage the prompt responses to inquiries submitted to the Online Knowledgebase on Indium�s website at http://www.indium.com. Ed has a degree in Chemical Technology from Mohawk Valley Community College.

All three will be located at Indium�s corporate headquarters in Clinton, NY, USA.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials,

and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001

registered.

For more information about Indium Corporation visit http://www.indium.com or email askus@indium.com

Feb 26, 2024 -

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

Feb 19, 2024 -

Indium Corporation Expert to Present Technical Paper at IMAPS France

Feb 19, 2024 -

Indium Corporation Prepared to Deliver Three Presentations at APEC 2024

Feb 19, 2024 -

Indium Corporation to Kick Off Season Three of EV InSIDER Live Webcast Series with Charging Session

Jan 29, 2024 -

Indium Corporation Experts to Present at SMTA Pan Pac

Jan 29, 2024 -

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Jan 29, 2024 -

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Jan 29, 2024 -

Indium Corporation Announces Updates to China Leadership Team

Jan 29, 2024 -

Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Europe

Jan 08, 2024 -

Indium Corporation Expert to Present at Power Device & Module Expo at NEPCON Japan

407 more news from Indium Corporation »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

Indium Corporation Appoints New Applications Engineers news release has been viewed 601 times

ICT Total SMT line Provider

One stop service for all SMT and PCB needs