SMT, PCB Electronics Industry News

Indium Corporation Appoints New Applications Engineers

Sep 04, 2005

Jim Hisert is new to Indium Corporation. He recently worked as a Mechanical Engineer at Fiber Instrument Sales in Oriskany, NY where he designed and patented a new fiber optic sensor. In his new role, he will focus on developing and supporting Indium�s Semiconductor Assembly Products. Jim has a degree in Mechanical Engineering from SUNY Institute of Technology.

Dan McCall started with Indium Corporation in 2004 as a Manufacturing Engineer. He now joins the Technical Support Department as an Applications Engineer where he will provide technical support to customers for fabricated

solder products. He has a degree in Mechanical Engineering Technologies from SUNY Institute of Technology.

Ed Briggs has been with Indium Corporation since 1990 and was most recently a Supervisor for Indium�s solder paste flux production. As an Applications Engineer, Ed will be responsible for providing internal email and telephone

support. He will also manage the prompt responses to inquiries submitted to the Online Knowledgebase on Indium�s website at http://www.indium.com. Ed has a degree in Chemical Technology from Mohawk Valley Community College.

All three will be located at Indium�s corporate headquarters in Clinton, NY, USA.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials,

and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001

registered.

For more information about Indium Corporation visit http://www.indium.com or email askus@indium.com

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