SMT, PCB Electronics Industry News

Indium Corporation to Exhibit at Semicon West

Jun 16, 2005

Indium Corporation�s exhibit will focus on Semiconductor, Power Semiconductor, and Specialty Solder Materials, including the first Reworkable Pb-Free No-Flow Underfill. In addition, Indium will feature Solder Wire, Solder Preforms, Tape & Reel Solder Preforms, Bumping Pastes, and TACFluxes. Indium�s exhibit will also include Pb-Free Solder Alloys and Solder Applications, such as Die-Attach and SMT Mixed-Technology.

SEMICON West is the largest exposition in North America dedicated to showcasing the technologies that enable the design and manufacture of micro and nano-scale electronics, including semiconductors, micro-electromechanical systems (MEMS), flat panel displays (FPDs) and related devices.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information on other trade shows at which Indium Corporation will be exhibiting, visit Indium Corporation at http://www.indium.com or email askus@indium.com.

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