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Indium Corporation to Exhibit at IMAPS � Cambridge

Feb 22, 2005

Indium Corporation will exhibit at IMAPS MicroTech 2005 on March 1 & 2. The show, is taking place at the Moller Conference Center in Cambridge, England, features Photonics, Power Packaging, Flip-Chip Technology, and Packaging

Reliability.

Indium Corporation�s exhibit will focus on Semiconductor, Power Semiconductor, and Specialty Solder Materials, including Solder Wire, Solder

Preforms, Tape & Reel Preforms, Bumping Pastes, TACFluxes and Underfills. In addition, Indium will feature Pb-Free Solder Alloys and Solder

Applications, such as Die Attach, Solder Fortifications, Package Construction, and SMT Mixed-Technology.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located

in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information, visit Indium Corporation at http://www.indium.com

or email askus@indium.com.

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