Best Author, Mike Fenner
Mike was chosen for this award for his ability to take complex and fragmented information and make it useful and practical for the solder user. Mike's papers include:
"Constant Solder Volumes for Consistent Assembly, A Guide to Solder Preforms"
"Understanding the Impact of Pb-Free on Solder Paste"
"How to Choose & Implement a Solder Paste for Pb-Free"
"A Comprehensive Strategy to Achieve Timely RoHS Compliance"
Mike lives in England and is based at Indium�s UK facility.
Best Paper, Tim Jensen Tim's paper entitled, "Solder Paste Evaluation Techniques to Simplify the Transition to Pb-Free" removes the confusion around conducting a Pb-Free solder paste evaluation. This timely paper will support Indium's customers in their move to Pb-Free.
Tim lives in Utica and is based at Indium�s global headquarters in Clinton, NY.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.