The new, 12-page catalog includes the first side-stackable BGA socket available on the market. Designated the Pin-Ball Socket, this device can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density. The Pin-Ball Socket incorporates Aries� reliable spring probe technology.
Also detailed are Aries� Correct-A-ChipTM technology and products, which enable designers to convert virtually any package type or footprint to any other. Typical Correct-A-Chip products include DIP-to-PLCC adapters, standard DIP adapters,
DIP-to-SOIC adapters, SMD-to-DIP adapters, PGA adapters, and countless other �from-to� configurations while enabling designers to upgrade without board redesign or rework.
Also included in the catalog are data and product information on Aries� High-Frequency RF Test Sockets, which utilize the company�s patented Microstrip ContactTM System.
Aries� line of BGA products for chip scale packaging is also covered in the catalog, as are Aries� LGA Sockets, Test & Burn-in Sockets, Display Sockets, Cable Jumper assemblies, DIP/SIP sockets and headers, programming devices and other socket packages.
To download a free copy of this new, 8th Edition Shortform Catalog visit Aries Electronics� website at http://www.arieselec.com and click on the "New Short-Form Catalogue" link, or for a free hard copy contact Aries at P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: firstname.lastname@example.org.
READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.
EDITORS NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip� product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.