SMT, PCB Electronics Industry News

Indium Corporation Introduces Water-Soluble Pb-Free Solder Paste

Oct 15, 2004

To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1. Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications. The unprecedented stencil life virtually eliminates solder paste waste.

In addition, Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere. Any residue is easily cleaned with water. The resultant solder joints are shiny and smooth, including those of ultra fine-pitch components.

Indium3.1 also features a wide reflow window, outstanding slump resistance, low voiding and low foaming. Standard packaging for stencil printing applications is 500g jars and 700g cartridges. In addition, Indium3.1 is backed up by Indium Corporation�s internationally experienced engineers who provide in-depth technical assistance and expert advice in solder properties.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Indium3.1, visit Indium Corporation of America at http://www.indium.com or email askus@indium.com.

Aug 30, 2016 -

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 09, 2016 -

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 03, 2016 -

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Apr 26, 2016 -

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 22, 2016 -

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 21, 2016 -

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 12, 2016 -

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 07, 2016 -

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 06, 2016 -

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Mar 29, 2016 -

Indium Corporation Names Hults as Global Accounts Manager

240 more news from Indium Corporation »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

Indium Corporation Introduces Water-Soluble Pb-Free Solder Paste news release has been viewed 718 times

IPC Training & Certification - Blackfox

SMT Custom Nozzles