The new RF socket provides minimal signal loss for higher bandwidth capability via a signal path of only .077� (1.95 mm). The 4-point spring probe crown on the new socket ensures �scrub� on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other socket types. Single point probes are available for small land area contact pads.
The socket can be easily mounted to and removed from the test board, due to solderless, pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws. These gold over nickel compression spring probes leave very small witness marks on the bottom of the device solder balls. In addition, the socket�s small overall size provides the maximum allowable space for load board components and connectors.
Estimated contact life is over 500,000 cycles and contact self-inductance is 0.51 nH. Contact forces of the new center probe sockets are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Operating temperature is -55�C to 150�C (-67�F to 302�F).
The compression spring probes are heat-treated beryllium copper alloy, plated with
30 �� min. (0.75 �m) gold per Mil-G-45204 over 30 �� min. (0.75 �m) nickel per QQ-N-290. The socket�s molded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.
As with all Aries sockets, the new RF test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a molded 415-lead RF Center Probe socket for 2.4 GHz applications starts at $1,122 each for up to nine pieces. Delivery is six weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.
Data sheet #24012�www.arieselec.com/products/24012.pdf.
READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825.
EDITORS NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip� product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.