SMT, PCB Electronics Industry News

Indium Corporation to Exhibit at Regional SMTA Shows

Sep 28, 2004

Indium Corporation of America will be exhibiting at several regional SMTA Trade Shows during the month of October, including:

� SMTA International Wafer Level Packaging Congress (IWLPC)

in San Jose (Oct 10-12)

� SMTA in Philadelphia (Oct. 12)

� SMTA in Long Island (Oct 14).

At the IWLPC show, Indium Corporation will be featuring Bumping Pastes, Underfills and Flip-Chip Fluxes, while the regional SMTA shows will focus on Pb-Free assembly processes and Water-Soluble Solder Paste. Experts in the field of electronic assembly materials will be on hand at each show to discuss current applications and alternative solutions.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Pb-free solders and through-hole assembly options for mixed-technology boards, visit Indium Corporation of America at http://www.indium.com or email askus@indium.com.

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