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Indium Corporation to Exhibit at Regional SMTA Shows

Sep 28, 2004

Indium Corporation of America will be exhibiting at several regional SMTA Trade Shows during the month of October, including:

� SMTA International Wafer Level Packaging Congress (IWLPC)

in San Jose (Oct 10-12)

� SMTA in Philadelphia (Oct. 12)

� SMTA in Long Island (Oct 14).

At the IWLPC show, Indium Corporation will be featuring Bumping Pastes, Underfills and Flip-Chip Fluxes, while the regional SMTA shows will focus on Pb-Free assembly processes and Water-Soluble Solder Paste. Experts in the field of electronic assembly materials will be on hand at each show to discuss current applications and alternative solutions.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Pb-free solders and through-hole assembly options for mixed-technology boards, visit Indium Corporation of America at http://www.indium.com or email askus@indium.com.

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