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Indium Corporation to Exhibit at ATExpo

Sep 02, 2004

Indium Corporation of America will be exhibiting at Assembly Technology Expo (booth # 5631) in Rosemont, IL on Sept. 28-30 focusing on Pb-Free Solders and Through-hole Assembly Options for Mixed-Technology Boards, using both leaded alloys and lead-free materials. On hand will be experts in the field of electronic assembly materials to discuss current applications and alternative solutions.

A technical article on Through-hole Assembly Options for Mixed-Technology Boards is available by contacting abrown@indium.com.

ATExpo is the world�s largest �all assembly� trade show featuring the newest technologies, ideas and solutions to optimize assembly operations. The event attracts around 600 suppliers and over 110,000 industry professionals from 25 countries.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Pb-free solders and through-hole assembly options for mixed-technology boards, visit Indium Corporation of America at http://www.indium.com or email askus@indium.com.

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