SMT, PCB Electronics Industry News

Reworkable Underfill Encapsulant for BGA's

Apr 27, 2004

CN-1453 Before Removal

CN-1453 Before Removal

After BGA Removal and Site Clean-up

After BGA Removal and Site Clean-up

Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453. It is a silica filled version of the company's earlier CN-1432, so it has a lower coefficient of thermal expansion of 45 ppm/°C, compared to 70 ppm/°C. This makes the product suited for more demanding applications.

Unlike flip chips, BGA's are not normally encapsulated. However, in applications where components must survive shock or vibration tests, such as in mobile phones or other handheld devices or in military electronics, an underfill encapsulant is used.

Since the value of assemblies can be quite high, reworkability of the encapsulant is critical for removal and replacement of a faulty BGA. Removal of defective components is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

CN-1453 has a viscosity of 7500 cps at room temperature, making it very easy to dispense. It is also fast flowing, capable of flowing a distance of 18 mm, with only a single-side dispense, in as little as 20 seconds. Curing, performed in an in-line oven, is complete in 5 minutes at 165°C. The excellent processability of CN-1453 makes it suited to high volume manufacturing.


Zymet is a manufacturer of microelectronic and electronic adhesives and encapsulants. Its products include die attach adhesives, substrate adhesives, UV curable glob top and cavity-fill encapsulants, and underfill encapsulants.

Feb 08, 2013 -

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Jan 13, 2012 -

New Underfill from Zymet for 0.4-mm pitch POP's

Apr 07, 2011 -

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Mar 17, 2010 -

Low CTE Reworkable Underfill for Superior Thermal Cycle Performance

Sep 17, 2009 -

Reworkable Underfill for Package-on-Package (POP)

Sep 25, 2003 -

Reworkable Underfill Encapsulant for CSP's and BGA's

Jul 26, 2017 -

KIC Appoints Accomplished Engineering Manager

Jul 26, 2017 -

Count On Tools Inc. Reduces Pricing on the QWIKTRAY Custom Matrix Tray System

Jul 26, 2017 -

StratEdge Introduces New, Mobile-Friendly Website www.stratedge.com serves as resource for high-frequency semiconductor packages

Jul 25, 2017 -

Matt Tringhese Named Director of Program Manufacturing for Libra Industries

Jul 25, 2017 -

Europlacer Expands its Manufacturing Facility in France.

Jul 25, 2017 -

Europlacer Appoints Giantec in Taiwan

Jul 25, 2017 -

Making Ovens Smarter – Visit KIC at NEPCON South China

Jul 25, 2017 -

SAKI America Appoints Alex Malek as Vice President Sales & Service, North America

Jul 25, 2017 -

Flawless transition in SEHO Product Management

Jul 25, 2017 -

ZESTRON Celebrates 25 Years of Globally Leading Innovation

See electronics manufacturing industry news »

Reworkable Underfill Encapsulant for BGA's news release has been viewed 3603 times

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit