May 30, 2003 International, with the Assembly Tech Expo (ATExpo) show this fall at the
Donald Stephens Convention Center in Rosemont, Illinois (Conference:
September 21-25 Exhibits: September 23-25).
This year's program will feature thirty full- and half-day short
courses. Seventeen are entirely new courses on today's most important
topics in electronics manufacturing, assembly, and related business issues:
Lean Manufacturing
Moisture Sensitive Devices
Quality Improvements in SMT Assembly
Design for Advanced IC Package Technology
High Density Manufacturing
Lead-free Implementation
Lead-free Solder Joint Reliability
PPM/DPMO Benchmarking
Competitive Advantage in Today's EMS Market
Low Volume SMT Assembly
Mastering BGA Processing & Rework - HANDS ON COURSE
0201 Design, Assembly, & Soldering
Low Cost & Advanced Flip Chip Technology & Processing
PWB Yield Management for Increased Profitability
Pin-in-Hole / Intrusive Reflow Design & Assembly
Selective Soldering
Outsourcing Lead-free Assembly
Featuring SMT, Flip Chip, MEMS, Chip Scale, BGA, Automotive, Lead-free,
Process Control and more, SMTA International is dedicated to surface mount,
advanced packaging, and related technologies. Led by conference chair Rob
Rowland, RadiSys Corporation, the highly regarded SMTA International
Technical Advisory Committee is comprised of electronics manufacturing and
packaging experts who represent all facets of the industry.
For developing information on SMTA International, visit the on-line
conference brochure at smta.org/smtai or contact SMTA administrator JoAnn
Stromberg at 952-920-7682 or joann@smta.org.
http://www.smta.org/smtai/index.cfm
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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