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THERMAL TESTING/PROFILING WITH LOW COST DUMMY SMT COMPONENTS

Jul 30, 2002

THERMAL TESTING/PROFILING WITH LOW COST DUMMY SMT COMPONENTS

Mechanical SMT samples also known as �dummies� can be used successfully and economically for thermal testing applications. For thermal applications just order your sample components to be assembled with a �dummy� silicon chip inside.

These chips have no circuitry or metalization (for wire bonding) and are not electrically connected inside the package to the leadframe or substrate making them the ideal subject for cost effective testing. The dummy die simulates the CTE (coefficient of thermal expansion) of a live part without the expense of a functional part since you are not paying for the design and fabrication of a functional die or the assembly costs associated with wire bonding and electrical testing.

All other physical materials and associated assembly processes used are the same for �dummy� SMT packages as for live packages at a substantial cost savings.

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