SMT, PCB Electronics Industry News

MYDATA boosts MELF component placement with new mount tool

Nov 30, 2001

A new unique mount tool for the HYDRA Speedmount high-speed head is now

released by MYDATA automation. The tool, called H04, makes it possible to

handle cylindrical components such as MELF and SOD80 with the HYDRA

Speedmount head.

The H04 boosts machine throughput significantly for boards with cylindrical

components since the mounting can be done with the multi-nozzle HYDRA head,

instead of the MIDAS single-nozzle head.

In addition, the H04 provides improved handling of high chip components

that have a height/width ratio near or over 1. The tool consists of an

adapter and a specially designed rubber tool tip and can handle components

in the range 0603-1206 chips, MELF3514, SOD-80.

The H04 tool is fully compatible with the HYDRA Automatic Tool Exchanger

(ATE) and can therefore be mixed with other types of tools on the mount

head to optimize production and boost throughput further. The HYDRA ATE has

four different tool types (H01, H02, H03, H04) and enables the

eight-nozzled HYDRA Speedmount to mount components ranging from 0402 on 8

mm tape to SO14s on 16 mm tape with seamless tool changes,

The top mounting speed with the H04 tool ranges from 14 000 CPH to 21 000

CPH, depending on component type and application.

For more information, please contact Mats Magnell, Director of Marketing on

phone number: +46 8 475 57 62.

MYDATA automation designs, manufactures and markets surface mount assembly

machines. Its business mission is to satisfy the needs of the electronics

industry for SMT equipment, while meeting its demands for flexibility and

high quality production.

Sweden-based MYDATA offers a worldwide network of sales and service support

and has subsidiaries in Great Britain, France, the United States, Japan and

Singapore, with agents and distributors globally.

You can find further information about MYDATA at our website:

www.mydata.com.

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