SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.
SHENMAO’s high thermal/drop reliability series solder alloys can be used in a wide range of solder applications. The alloys have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging processes.
The PF906-S Sn/Ag4.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal reliability and is designed for use in automotive electronic applications.
The PF912-S Sn/Ag2.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal and impact reliability compared to conventional solder alloys such as SAC305 and SAC405.
SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America. For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.